74ahc14; 74ahct14 hex inverting schmitt trigger

74AHC14; 74AHCT14
Hex inverting Schmitt trigger

Rev. 04 — 25 April 2008
Product data sheet
General description
The 74AHC14; 74AHCT14 is a high-speed Si-gate CMOS device and is pin compatiblewith Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standardNo. 7A.
The 74AHC14; 74AHCT14 provides six inverting buffers with Schmitt-trigger action. Theyare capable of transforming slowly changing input signals into sharply defined, jitter-freeoutput signals.
Features
■ Balanced propagation delays■ All inputs have Schmitt-trigger actions■ Inputs accept voltages higher than VCC■ Input levels: ◆ For 74AHC14: CMOS level◆ For 74AHCT14: TTL level ◆ HBM EIA/JESD22-A114E exceeds 2000 V◆ MM EIA/JESD22-A115-A exceeds 200 V◆ CDM EIA/JESD22-C101C exceeds 1000 V ■ Multiple package options■ Specified from −40 °C to +85 °C and from −40 °C to +125 °C NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
Ordering information
Ordering information
Type number
Temperature range Name
Description
plastic thin shrink small outline package; 14 leads; plastic dual in-line compatible thermal enhanced very SOT762-1thin quad flat package; no leads; 14 terminals; body2.5 × 3 × 0.85 mm 74AHCT14
plastic thin shrink small outline package; 14 leads; plastic dual in-line compatible thermal enhanced very SOT762-1thin quad flat package; no leads; 14 terminals; body2.5 × 3 × 0.85 mm Functional diagram
Logic symbol
IEC logic symbol
Logic diagram
(one Schmitt-trigger)

NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
Pinning information
5.1 Pinning
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as asupply pin or input.
Pin configuration SO14 and TSSOP14
Pin configuration DHVQFN14
5.2 Pin description
Pin description
Description
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
Functional description
Function table
Limiting values
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Parameter
Conditions
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.
For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.
For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K.
Recommended operating conditions
Operating conditions
Parameter
Conditions
74AHCT14
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
Static characteristics
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
40 °C to +85 °C 40 °C to +125 °C Unit
74AHCT14
VI = VCC − 2.1 V; other pinsat VCC or GND; IO = 0 A;VCC = 4.5 V to 5.5 V NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
10. Dynamic characteristics
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter
Conditions
40 °C to +85 °C 40 °C to +125 °C Unit
74AHCT14
Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).
CPD is used to determine the dynamic power dissipation (PD in µW).
P fi = input frequency in MHz;fo = output frequency in MHz;CL = output load capacitance in pF;VCC = supply voltage in V;N = number of inputs switching;Σ(C NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
11. Waveforms
VOL and VOH are typical voltage output levels that occur with the output load.
Input to output propagation delays
Measurement points
RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance Load circuitry for measuring switching times
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
Test data
12. Transfer characteristics
Table 10.
Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see and .
Symbol Parameter
Conditions
40 °C to +85 °C 40 °C to +125 °C Unit
74AHCT14
13. Transfer characteristics waveforms
Transfer characteristics
Transfer characteristics definitions
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
Fig 10. Typical 74AHC transfer characteristics
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
Fig 11. Typical 74AHCT transfer characteristics
14. Application information
For 74AHC14: f = -- ≈ ------------ For 74AHCT14: f = -- ≈ ------------ Fig 12. Relaxation oscillator
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
15. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES
EUROPEAN
ISSUE DATE
PROJECTION
Fig 13. Package outline SOT108-1 (SO14)
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
DIMENSIONS (mm are the original dimensions)
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
EUROPEAN
ISSUE DATE
PROJECTION
Fig 14. Package outline SOT402-1 (TSSOP14)
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm

SOT762-1
DIMENSIONS (mm are the original dimensions)
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES
EUROPEAN
ISSUE DATE
PROJECTION
Fig 15. Package outline SOT762-1 (DHVQFN14)
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
16. Abbreviations
Table 11.
Abbreviations
Description
Low-power Schottky Transistor-Transistor Logic 17. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
The format of this data sheet has been redesigned to comply with the new identity
Legal texts have been adapted to the new company name where appropriate.
or input leakage current have been changed.
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
18. Legal information
Data sheet status
Document status[1][2]
Product status[3]
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product statusinformation is available on the Internet at URL Definitions
malfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under
NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk.
modifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these
information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for thespecified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
Limiting values — Stress above one or more limiting values (as defined in
for quick reference only and should not be relied upon to contain detailed and the Absolute Maximum Ratings System of IEC 60134) may cause permanent full information. For detailed and full information see the relevant full data damage to the device. Limiting values are stress ratings only and operation of sheet, which is available on request via the local NXP Semiconductors sales the device at these or any other conditions above those given in the office. In case of any inconsistency or conflict with the short data sheet, the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
Disclaimers
subject to the general terms and conditions of commercial sale, as publishedat , including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unless General — Information in this document is believed to be accurate and
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of reliable. However, NXP Semiconductors does not give any representations or any inconsistency or conflict between information in this document and such warranties, expressed or implied, as to the accuracy or completeness of such terms and conditions, the latter will prevail.
information and shall have no liability for the consequences of use of such No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the Right to make changes — NXP Semiconductors reserves the right to make
grant, conveyance or implication of any license under any copyrights, patents changes to information published in this document, including without or other industrial or intellectual property rights.
limitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.
Trademarks
Suitability for use — NXP Semiconductors products are not designed,
Notice: All referenced brands, product names, service names and trademarks authorized or warranted to be suitable for use in medical, military, aircraft, are the property of their respective owners.
space or life support equipment, nor in applications where failure or 19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 25 April 2008
NXP Semiconductors
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
20. Contents
Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.
NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected] Date of release: 25 April 2008
Document identifier: 74AHC_AHCT14_4

Source: http://www.electronshik.ru/pdf/pdf/7/74ahc_ahct14_4.pdf

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